Advanced Packaging Microelectronics Integration Engineer

1w1 week ago

SkyWater Technology

Kissimmee, US · Full-time · $158,960 – $238,440

About this role

SkyWater Technology manufactures U.S.-made semiconductors essential for automotive safety, life-saving medical devices, consumer electronics, and American security. At the Florida Advanced Packaging site, lead development and improvement of integrated process flows to deliver qualified products to foundry clients. Excellent oral and written communication skills enable collaboration with customers, colleagues, and management.

Transfer client package requests into process flows utilizing Si interposer, Fan-Out, and hybrid bonding manufacturing processes. Identify areas requiring development and lead the process team to achieve high yield and on-schedule delivery. Lead task forces to identify root causes, implement corrections, and maintain product deliverables.

Gain knowledge of tool set capabilities including temporary and permanent bonding, electrolytic/PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, and wire bond tools. Work with process and tool engineers to address marginalities and improvements. Routinely monitor in-line and end-of-line SPC charts for trends or excursions.

Process integration supports MEMS, Photonics, High Performance Computing, CMOS, Memory, AI, and Quantum devices. Contribute to turning science fiction into reality through technologies like 3D integrated circuits, carbon nanotubes, and photonic logic devices. Join a team guided by Integrity, Excellence, Collaboration, Empowerment, and Growth Mindset.

Requirements

Experience leading advanced packaging process integration for foundry clients
Knowledge of Si interposer, Fan-Out, and hybrid bonding manufacturing process flows
Familiarity with semiconductor tool sets: electrolytic/PVD deposition, dielectric deposition, photolithography, etch, CMP
Proficiency in TSV first and last integration processes
Skills in metrology for process characterization and defect root cause analysis
Ability to integrate diverse devices including MEMS, Photonics, HPC, CMOS, Memory, AI, Quantum
Experience with data analysis software and SPC chart monitoring for process improvements
Background in electrical test parametrics and creating end-to-end process flows

Responsibilities

Transfer client package requests into process flows utilizing Si interposer, Fan-Out, and hybrid bonding manufacturing processes
Identify areas requiring development and lead process team to deliver qualifiable product on schedule with high yield
Lead task forces to identify root causes, correct issues, and maintain product deliverables
Utilize knowledge of tool sets including temporary/permanent bonding, metal deposition, photolithography, etch, CMP, flip chip, and wire bond
Integrate TSV first and/or last process flows to enable foundry client packages
Use metrology tools to characterize process conditions, identify defects, and document results
Drive integration changes for improved device performance and yield improvement
Monitor SPC charts, utilize data analysis software, and incorporate electrical test parametrics

Benefits

Manufacture products for aerospace, defense, medical, automotive, consumer, and industrial markets
Work with emerging leaders relying on intellectual property security and quality services
Contribute to commercializing technologies like 3D integrated circuits, carbon nanotubes, photonic devices
Join empowered learning environment investing in employees from military and diverse backgrounds